Rao Bonda
Director, Flip Chip Bga Products Business Unit at Amkor Technology
Email: r****@amkor.com
Phone Number: (***)-***-****
Proven technology leader in electronic packaging with extensive experience in technology development and new product introduction. Established experience in collaborating with customers, ...
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AMKOR TECHNOLOGY
- Headquarters: 2045 E Innovation Crk, Tempe, Arizona, 85284, United States
- Industry Semiconductors
- Website amkor.com
- HQ Phone 48********
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Description
Amkor Technology is one of the worlds largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and ...Read More
- Employees 10001+
- Revenue 1 Billion and Over
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Frequently Asked Questions Regarding Rao Bonda
Answer: Rao Bonda works for Amkor Technology as Director, Flip Chip Bga Products Business Unit
Answer: Rao Bonda’s role in Amkor Technology is Director, Flip Chip Bga Products Business Unit
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Answer: Rao Bonda is the current Director, Flip Chip Bga Products Business Unit at Amkor Technology.... Read More
Answer: Rao Bonda works Amkor Technology located at 2045 E Innovation CRK, Tempe, Arizona, 85284, United States
Answer: Amkor Technology's Director, Flip Chip Bga Products Business Unit is Rao Bonda
Answer: Rao Bonda contact details:
- Phone number : (***)-***-****
- Email : r****@amkor.com
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