Amkor Technology
Semiconductors, 2045 E Innovation CRK, Tempe, Arizona, 85284, United States, 10001+ Employees
Phone Number: 48********
Who is AMKOR TECHNOLOGY
Amkor Technology is one of the worlds largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test ...
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- Headquarters: 2045 E Innovation CRK, Tempe, Arizona, 85284, United States
- Date Founded: 1968
- Employees: 10001+
- Revenue: $1 Billion and Over
- Active Tech Stack: See technologies
- CEO: Ken Joyce
Industry: Semiconductors
SIC Code: 3674 | NAICS Code: 334413 | Show More
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Frequently Asked Questions Regarding Amkor Technology
Answer: Amkor Technology's headquarters are located at 2045 E Innovation CRK, Tempe, Arizona, 85284, United States
Answer: Amkor Technology's phone number is 48********
Answer: Amkor Technology's official website is https://amkor.com
Answer: Amkor Technology's revenue is $1 Billion and Over
Answer: Amkor Technology's SIC: 3674
Answer: Amkor Technology's NAICS: 334413
Answer: Amkor Technology has 10001+ employees
Answer: Amkor Technology is in Semiconductors
Answer: Amkor Technology contact info: Phone number: 48******** Website: https://amkor.com
Answer: Amkor Technology is one of the worlds largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the worlds leading semiconductor companies, foundries, and electronics OEMs. Amkors operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkors packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
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