Amkor Technology

Amkor Technology

Semiconductors, 2045 E Innovation CRK, Tempe, Arizona, 85284, United States, 10001+ Employees

amkor.com

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Who is AMKOR TECHNOLOGY

Amkor Technology is one of the worlds largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test ...

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  • 2045 E Innovation CRK, Tempe, Arizona, 85284, United States Headquarters: 2045 E Innovation CRK, Tempe, Arizona, 85284, United States
  • 1968 Date Founded: 1968
  • 10001+ Employees: 10001+
  • dollar-icon Revenue: $1 Billion and Over
  • tech-icon Active Tech Stack: See technologies
  • Ken Joyce CEO:   Ken Joyce

industries-icon Industry: Semiconductors

SIC SIC Code: 3674 | NAICS Code: 334413 | Show More

checked-icon Does something look wrong? Fix it. | View contact records from AMKOR TECHNOLOGY

Amkor Technology Org Chart and Mapping

VP-Level
VP-Level

Adrian Arcedera

SVP - Mems, Sensor and Wb Bga Products

Employees

Michael Flatley

Manager, Mlf Products - Leadframe Products

Mike Hladik

VP - Strategic Sourcing

Tadd Hinze

Sr Director - Finance, Inventory

Ruben Fuentes

Vice President - Ww Design

Michelle Martens

Analyst - Accounts Receivables

Brent Newman

Director, Test Technical Program Management (Test Tpm)

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Frequently Asked Questions Regarding Amkor Technology

Answer: Amkor Technology's headquarters are located at 2045 E Innovation CRK, Tempe, Arizona, 85284, United States

Answer: Amkor Technology's phone number is 48********

Answer: Amkor Technology's official website is https://amkor.com

Answer: Amkor Technology's revenue is $1 Billion and Over

Answer: Amkor Technology's SIC: 3674

Answer: Amkor Technology's NAICS: 334413

Answer: Amkor Technology has 10001+ employees

Answer: Amkor Technology is in Semiconductors

Answer: Amkor Technology contact info: Phone number: 48******** Website: https://amkor.com

Answer: Amkor Technology is one of the worlds largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the worlds leading semiconductor companies, foundries, and electronics OEMs. Amkors operational base includes production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the USA. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly, and final test. The availability of high-quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkors packaging formats include wafer-level, CSP, BGA, leadframe and the enablement of next-generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.

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