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Jacob Heisler

Mircoelectronics Packaging Engineer at first level

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FIRST LEVEL

FIRST LEVEL

  • description Description
    First Level Inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected clean rooms for die attach...

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  • Employees count Employees 11-50
  • Revenue Revenue 25 Million to 50 Million
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Answer: first level's Mircoelectronics Packaging Engineer is Jacob Heisler

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  • Phone number  :  (***)-***-****
  • Email  :  j****@firstlevelinc.com

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