Daniel Mingolla
Field Application Engineer at Summit Interconnect
Email:
d****@winonics.com
Phone Number: (***)-***-****
• Assembly Engineer Manager and Planner for PCB and CAD/CAM drafter designer with extensive experience providing technical design direction on manufacturing printed circuit boards, mechan...
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SUMMIT INTERCONNECT
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Headquarters: 223 N Cres Way, Anaheim, California, 92801, United States
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Industry Other Manufacturing
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Website summit-pcb.com
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HQ Phone 71********
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Description
Summit Interconnect is one of the leading providers of complex, rigid, and flexible printed circuit boards in North America, offering solutions ranging from advanced prototyping to high mix, ...Read More
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Employees 501-1000
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Revenue 50 Million to 100 Million
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Frequently Asked Questions Regarding Daniel Mingolla
Answer: Daniel Mingolla works for Summit Interconnect as Field Application Engineer
Answer: Daniel Mingolla’s role in Summit Interconnect is Field Application Engineer
Answer: Daniel Mingolla's email address is d***@gmail.com
Answer: Daniel Mingolla's business email address is d****@winonics.com
Answer: Daniel Mingolla’s direct phone number is (***)-***-****
Answer: Daniel Mingolla works in the industry of: Other Manufacturing
Answer: Daniel Mingolla is the current Field Application Engineer at Summit Interconnect.... Read More
Answer: Daniel Mingolla works Summit Interconnect located at 223 N Cres Way, Anaheim, California, 92801, United States
Answer: Summit Interconnect's Field Application Engineer is Daniel Mingolla
Answer: Daniel Mingolla contact details:
- Phone number : (***)-***-****
- Email : d****@winonics.com
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