Brian Devine
Tool and Die Designer - Principal at FIT-Foxconn Interconnect Technology
Email:
b****@samtec.com
Phone Number: (***)-***-****
Knowledge of various aspects of the tool and die trade including high speed progressive stamping and forming dies, deep draw dies, compound dies, blank draw and curl dies, pinch trim dies...
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FIT-FOXCONN INTERCONNECT TECHNOLOGY
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Headquarters: 121 Theory Ste 200, Irvine, California, 92617, United States
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Industry Consumer Electronics
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Website fit-foxconn.com
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HQ Phone 40********
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Employees 10001+
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Revenue 25 Million to 50 Million
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Answer: Brian Devine works for FIT-Foxconn Interconnect Technology as Tool and Die Designer - Principal
Answer: Brian Devine’s role in FIT-Foxconn Interconnect Technology is Tool and Die Designer - Principal
Answer: Brian Devine's email address is b***@gmail.com
Answer: Brian Devine's business email address is b****@samtec.com
Answer: Brian Devine’s direct phone number is (***)-***-****
Answer: Brian Devine works in the industry of: Consumer Electronics
Answer: Brian Devine is the current Tool and Die Designer - Principal at FIT-Foxconn Interconnect Technology.... Read More
Answer: Brian Devine works FIT-Foxconn Interconnect Technology located at 121 Theory Ste 200, Irvine, California, 92617, United States
Answer: FIT-Foxconn Interconnect Technology's Tool and Die Designer - Principal is Brian Devine
Answer: Brian Devine contact details:
- Phone number : (***)-***-****
- Email : b****@samtec.com
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