Skyphos Technologies
Biotechnology, 2000 Kraft Drive, Blacksburg, Virginia, 24060, United States, 1-10 Employees
Who is SKYPHOS TECHNOLOGIES
Skyphos is an award winning service company for microfluidics and lab on a chip. We use our own patented micro-3D Printer and resins for the specific purpose of fabricating micro-devices....
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Headquarters: 2000 Kraft Drive, Blacksburg, Virginia, 24060, United States
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Date Founded: 2017
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Employees: 1-10
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Revenue: Under $1 Million
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Active Tech Stack: See technologies
Industry: Biotechnology
SIC Code: 3674
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NAICS Code: 334413 |
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Frequently Asked Questions Regarding Skyphos Technologies
Answer: Skyphos Technologies's headquarters are located at 2000 Kraft Drive, Blacksburg, Virginia, 24060, United States
Answer: Skyphos Technologies's official website is https://skyphos.tech
Answer: Skyphos Technologies's revenue is Under $1 Million
Answer: Skyphos Technologies's SIC: 3674
Answer: Skyphos Technologies's NAICS: 334413
Answer: Skyphos Technologies has 1-10 employees
Answer: Skyphos Technologies is in Biotechnology
Answer: Skyphos Technologies contact info: Phone number: Website: https://skyphos.tech
Answer: Skyphos is an award winning service company for microfluidics and lab on a chip. We use our own patented micro-3D Printer and resins for the specific purpose of fabricating micro-devices. We offer rapid prototyping - ideal for developing next-gen healthcare platforms, microfluidics, lab-on-a-chip (LOC), and Point-Of-Care (POC) medical diagnostics. Follow our page so you can stay up to date. Development without mold delays: Our 3D printing technology process doesnt require molds, which makes design revisions fast and easy without increasing costs. 3D printing technology on the microscale : Skyphos fabricates on-device components ranging in size from single-digit microns to several inches within the same print, enabling prototyping on-demand and outside of a clean-roomfor the first time. Our machine and processes were designed from the ground up, allowing us to fabricate true 3D structures and devices previously not possible, radically altering the consumption and fabrication models for Microelectromechanical systems (MEMS) and LOC.
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