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Lei Shan

Packaging & Integration for Arm-Based Cloud Native Processors at Ampere

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Fully exploit pragmatic skills, professional connections, and broad spectrum of experience/knowledge with innovative mind, while leveraging team power to provide high-speed I/O and hetero...

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AMPERE

AMPERE

  • description Description
    Ampere is a modern semiconductor company designing the future of hyperscale cloud and edge computing with the worlds first Cloud Native Processors. Built for the sustainable cloud with a mode...

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  • Employees count Employees 1001-5000
  • Revenue Revenue 250 Million to 500 Million
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Ampere Org Chart and Mapping

Renee James

Founder, Chairman & CEO

VP-Level
Employees

Abishek Madhavan

Senior Engineering Manager

Prathiksha Dhanpal

Package and Systems Interconnect Engineer

Frank Lee

Director of Engineering, Ai/Ml

Paul Lee

Senior Staff Test Engineer

Yoham Parelkar

L-7 Package & Systems Engineer

Joshua Levy

Principal Platform Hardware Engineer

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Answer: Ampere's Packaging & Integration for Arm-Based Cloud Native Processors is Lei Shan

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  • Phone number  :  (***)-***-****
  • Email  :  l****@amperecomputing.com

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