Universal Engineering Consulting Services
Aviation & Aerospace, 601 S Main St, Grapevine, Texas, 76051, United States, 1-10 Employees
Phone Number: 97***********
Who is UNIVERSAL ENGINEERING CONSULTING SERVICES
Edwin Odette is the President of UECS. Founded in 2016, UECS, LLC. is a Denver-based engineering services and sales rep company that has brought to market qualified franchised alternates/...
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Headquarters: 601 S Main St, Grapevine, Texas, 76051, United States
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Date Founded: 2016
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Employees: 1-10
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Revenue: Under $1 Million
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Active Tech Stack: See technologies
Industry: Aviation & Aerospace
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Frequently Asked Questions Regarding Universal Engineering Consulting Services
Answer: Universal Engineering Consulting Services's headquarters are located at 601 S Main St, Grapevine, Texas, 76051, United States
Answer: Universal Engineering Consulting Services's phone number is 97***********
Answer: Universal Engineering Consulting Services's official website is https://uecservice.com
Answer: Universal Engineering Consulting Services's revenue is Under $1 Million
Answer: Universal Engineering Consulting Services has 1-10 employees
Answer: Universal Engineering Consulting Services is in Aviation & Aerospace
Answer: Universal Engineering Consulting Services contact info: Phone number: 97*********** Website: https://uecservice.com
Answer: Edwin Odette is the President of UECS. Founded in 2016, UECS, LLC. is a Denver-based engineering services and sales rep company that has brought to market qualified franchised alternates/crosses and die extraction and repackaging services, as a solution for obsolescence while extending life and improving reliability of integrated circuits. Ed Odette began his career in the Defense Industry in 1976. He realized there was a more efficient and productive way to Research, Resolve, and Restore the electronic component supply chain to manage obsolescence. UECS, LLC works directly with the Original Component Manufactures Field Application Engineers to identify and propose form, fit, and functional alternates/crosses or functionally equivalent donor parts for bare and extracted die to repackage in the customers desired footprint to resolve electronic component obsolescence.
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