Tj Green Associates
Military, 739 Redfern Ln, Bethlehem, Pennsylvania, 18017, United States, 1-10 Employees
Phone Number: +16*********
Who is TJ GREEN ASSOCIATES
TJ Green Associates is uniquely qualified in all aspects of microelectronic device assembly, materials/process development, failure analysis, inspection, and defect recognition. We provid...
Read More
-
Headquarters: 739 Redfern Ln, Bethlehem, Pennsylvania, 18017, United States
-
Date Founded: 2002
-
Employees: 1-10
-
Revenue: Under $1 Million
-
Active Tech Stack: See technologies
SIC Code: 
Does something look wrong? Fix it. | View contact records from TJ GREEN ASSOCIATES
TJ Green Associates Org Chart and Mapping
Email
Phone
Sign in to CIENCE GO Data to uncover contact details
Free credits every month
Frequently Asked Questions Regarding TJ Green Associates
Answer: TJ Green Associates's headquarters are located at 739 Redfern Ln, Bethlehem, Pennsylvania, 18017, United States
Answer: TJ Green Associates's phone number is +16*********
Answer: TJ Green Associates's official website is https://tjgreenllc.com
Answer: TJ Green Associates's revenue is Under $1 Million
Answer: TJ Green Associates's SIC: 8748
Answer: TJ Green Associates's NAICS: 541618
Answer: TJ Green Associates has 1-10 employees
Answer: TJ Green Associates is in Military
Answer: TJ Green Associates contact info: Phone number: +16********* Website: https://tjgreenllc.com
Answer: TJ Green Associates is uniquely qualified in all aspects of microelectronic device assembly, materials/process development, failure analysis, inspection, and defect recognition. We provide microelectronics training and microelectronics consulting services that will enable you to identify problems before they happen and determine the appropriate cause and corrective actions in order to maximize production yield and eliminate field failures in mission critical applications. A veteran-owned small business, TJ Green Associates provides teaching and consulting services to companies around the world with expertise in hermeticity, materials and processes used to assemble hybrid microcircuits, multichip modules, microwave hybrids, RF/MMIC modules, MEMS, Class III medical implants, optoelectronics, and other types of packaged microcircuits.
Premium Sales Data for Prospecting
-
Sales data across over 200M records
-
Up-to-date records (less decayed data)
-
Accurate Email Lists (real-world tested)
-
Powerful search engine and intuitive interface
Get Full Access
Sign in to CIENCE GO Data to uncover contact details
Free credits every month