Thermal Conductive Bonding
Semiconductors, 19 Great Oaks BLVD Ste 20, San Jose, California, 95119, United States, 51-200 Employees
Who is THERMAL CONDUCTIVE BONDING
TCB provides specialty bonding of materials for application in CVD, PVD, sputter and semiconductor equipment. TCB has developed proprietary bonding techniques for joining cylinders of mat...
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- Headquarters: 19 Great Oaks BLVD Ste 20, San Jose, California, 95119, United States
- Date Founded: 1998
- Employees: 51-200
- Revenue: $5 Million to $10 Million
- Active Tech Stack: See technologies
Industry: Semiconductors
SIC Code: 5049
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Frequently Asked Questions Regarding Thermal Conductive Bonding
Answer: Thermal Conductive Bonding's headquarters are located at 19 Great Oaks BLVD Ste 20, San Jose, California, 95119, United States
Answer: Thermal Conductive Bonding's official website is https://tcbonding.com
Answer: Thermal Conductive Bonding's revenue is $5 Million to $10 Million
Answer: Thermal Conductive Bonding's SIC: 5049
Answer: Thermal Conductive Bonding has 51-200 employees
Answer: Thermal Conductive Bonding is in Semiconductors
Answer: Thermal Conductive Bonding top competitors include: Addison Engineering , Dynatex International , INNOViON Corporation
Answer: Thermal Conductive Bonding contact info: Phone number: Website: https://tcbonding.com
Answer: TCB provides specialty bonding of materials for application in CVD, PVD, sputter and semiconductor equipment. TCB has developed proprietary bonding techniques for joining cylinders of materials to supporting tubes, enabling the construction of very long cylindrical targets to coat large surface areas more cost effectively then planar targets. TCB successfully collaborated with engineers in the flat panel industry to develop a process where we can bond small or large surface area sputtering targets greater than 100 sq. feet. TCB also supports thin- film deposition of materials for many applications including solar. We at TCB are proud of our engineering accomplishments and continuing ability to innovate and develop technology to service our customers.
Answer:
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