MRSI SYSTEMS

Mrsi Systems

Industrial Automation, 101 Billerica Ave BLDG 3, Tewksbury, Massachusetts, 01862, United States, 1001-5000 Employees

mrsisystems.com

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Who is MRSI SYSTEMS

MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for resear...

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  • 101 Billerica Ave BLDG 3, Tewksbury, Massachusetts, 01862, United States Headquarters: 101 Billerica Ave BLDG 3, Tewksbury, Massachusetts, 01862, United States
  • 2013 Date Founded: 2013
  • 1001-5000 Employees: 1001-5000
  • dollar-icon Revenue: $10 Million to $25 Million
  • tech-icon Active Tech Stack: See technologies

industries-icon Industry: Industrial Automation

SIC SIC Code: 3451 | NAICS Code: 332721 | Show More

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MRSI SYSTEMS Org Chart and Mapping

Employees

Jon Medernach

Regional Sales Manager

Nathan Fall

Applications & Support Engineer

John Hayes

Sr Applications Engineer

Ryan Fahey

Software Engineer II

Manoj Walvekar

Staff Engineering Project Specialist

Yi Qian

VP at Mycronic & GM for Mrsi Systems

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Frequently Asked Questions Regarding MRSI SYSTEMS

Answer: MRSI SYSTEMS's headquarters are located at 101 Billerica Ave BLDG 3, Tewksbury, Massachusetts, 01862, United States

Answer: MRSI SYSTEMS's phone number is 97********

Answer: MRSI SYSTEMS's official website is https://mrsisystems.com

Answer: MRSI SYSTEMS's revenue is $10 Million to $25 Million

Answer: MRSI SYSTEMS's SIC: 3451

Answer: MRSI SYSTEMS's NAICS: 332721

Answer: MRSI SYSTEMS has 1001-5000 employees

Answer: MRSI SYSTEMS is in Industrial Automation

Answer: MRSI SYSTEMS contact info: Phone number: 97******** Website: https://mrsisystems.com

Answer: MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 35+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging.

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