LPMS USA

Lpms Usa

Consumer Electronics, 1441 Branding Ave Ste 110, Downers Grove, Illinois, 60515, United States, 11-50 Employees

lpms-usa.com

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Who is LPMS USA

LPMS USA Low Pressure Molding Solutions from Design to Production LPMS USA specializes in low pressure molding solutions and offers a complete turnkey solution from collaborative engineer...

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  • 1441 Branding Ave Ste 110, Downers Grove, Illinois, 60515, United States Headquarters: 1441 Branding Ave Ste 110, Downers Grove, Illinois, 60515, United States
  • 2014 Date Founded: 2014
  • 11-50 Employees: 11-50
  • dollar-icon Revenue: $1 Million to $5 Million
  • tech-icon Active Tech Stack: See technologies

industries-icon Industry: Consumer Electronics

SIC SIC Code: 3559

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Frequently Asked Questions Regarding LPMS USA

Answer: LPMS USA's headquarters are located at 1441 Branding Ave Ste 110, Downers Grove, Illinois, 60515, United States

Answer: LPMS USA's phone number is +18*********

Answer: LPMS USA's official website is https://lpms-usa.com

Answer: LPMS USA's revenue is $1 Million to $5 Million

Answer: LPMS USA's SIC: 3559

Answer: LPMS USA has 11-50 employees

Answer: LPMS USA is in Consumer Electronics

Answer: LPMS USA contact info: Phone number: +18********* Website: https://lpms-usa.com

Answer: LPMS USA Low Pressure Molding Solutions from Design to Production LPMS USA specializes in low pressure molding solutions and offers a complete turnkey solution from collaborative engineering and prototyping; to a wide range of equipment offerings, including handheld, tabletop units and advanced in-line automated platforms; to full-service contract manufacturing and material distribution. LPMS USA is an authorized distributor of Henkel TECHNOMELT, Bostik Thermelt and Toyobo Vyloshot materials. Low pressure molding is a fast, single-step process that encapsulates, seals and protects electronics. Cycle times are reduced to seconds, compared to traditional potting, which that can take up to 24 hours. The low pressure molding material can be "skylined" around electronics, reducing raw material and eliminating the housing. The low injection pressures easily mold around fragile components, and low temperatures minimize heat exposure to sensitive electronics. EQUIPMENT: - Faster cycle times compared to potting - Reduced production steps -- no cure - Lower cost per part - Flexible equipment platforms including vertical and horizontal injection - Custom designed equipment - Equipment installation and training MATERIAL: - Environmental, impact, vibration protection - Waterproof - Strain relief - One-component - Sustainable, No-VOC, Minimal waste CONTRACT MANUFACTURING: - Low pressure molding of protecting PCBs, connectors, wire and cables - High and low volume production - Fast turn around time - Quality controls based on customer requirements - Exclusive low pressure molding manufacturer in North America - Global support and manufacturing network ENGINEERING: - Molding and material expertise - Prototyping - Mold Design - Engineering consulting - Defining production process parameters - Optimizing current production process - Expertise in converting potting to low pressure molding

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