Kyec

Answer: KYEC's official website is https://kyec.com.tw

Answer: KYEC's revenue is $1 Million to $5 Million

Answer: KYEC's SIC: 8734

Answer: KYEC's NAICS: 541380

Answer: KYEC has 5001-10000 employees

Answer: KYEC is in Semiconductors

Answer: KYEC contact info: Phone number: Website: https://kyec.com.tw

Answer: King Yuan Electronics Corp. (KYEC) provides wafer probing, final product test and assembly service for the semiconductor backend supply chain. KYEC is the second-largest firm in terms of testing revenue and the largest professional pure-play testing company worldwide. Founded in May 1987, headquarter of KYEC is located on the Gongdaowu Road in Hsinchu, Taiwan. The primary production factories are situated in Miaoli County. The subsidiaries of KYEC, King Long Technology and Zhen Kun Technology are situated in the Suzhou Industrial Park in China. Both subsidiaries package and test semiconductor products and serve as the production and marketing bases of KYEC in China, providing immediate services to the Chinese market. KYEC also established regional offices in North America, Japan, and Singapore to provide immediate business services for customers worldwide. The factory area of KYEC in Taiwan is approximately 288,500 m2. The floor area of the factory is approximately 434,000 m2. The clean room area is 207,000 m2. The factory area and clean room area in Suzhou are 72,500 m2 and 45,400 m2, respectively. KYEC provides packaging and testing services for the back-end process of semiconductor production globally. The provided services include wafer probing, final product test, burn-in test, assembly services and other services. The production line covers Memory, Logic and Mixed-Signal, System on Chip (SOC), CMOS Image sensor (CIS) / Charge-Coupled Device (CCD), Liquid Crystal Display Driver (LCDD), Radio Frequency (RF) / Wireless and Micro Electro Mechanical system (MEMS) test solutions. KYEC has over 4000 test platforms in total. KYEC provides packaging services for Ball Grid Array (BGA), Quad Flat No-Lead (QFN)/Dual Flat No-Lead (DFN), Thin Small Outline Packages (TSOP), Land grid array (LGA), Embedded Multimedia Card (eMMC) / embedded Multi Chip Package (eMCP), Memory Card/ MICRO SD Card.

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