Grinding And Dicing Services
Semiconductors, 925 Berryessa Rd, San Jose, California, 95133, United States, 11-50 Employees
Phone Number: +14*********
Who is GRINDING AND DICING SERVICES
The most experienced US supplier targeting complex wafer dicing and grinding services for diverse market segments including semiconductor, MEMS and life sciences to name a few. Continuity...
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Headquarters: 925 Berryessa Rd, San Jose, California, 95133, United States
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Date Founded: 1992
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Employees: 11-50
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Revenue: Under $1 Million
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Active Tech Stack: See technologies
Industry: Semiconductors
SIC Code: 3674
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Frequently Asked Questions Regarding Grinding and Dicing Services
Answer: Grinding and Dicing Services's headquarters are located at 925 Berryessa Rd, San Jose, California, 95133, United States
Answer: Grinding and Dicing Services's phone number is +14*********
Answer: Grinding and Dicing Services's official website is https://dieprepservices.com
Answer: Grinding and Dicing Services's revenue is Under $1 Million
Answer: Grinding and Dicing Services's SIC: 3674
Answer: Grinding and Dicing Services has 11-50 employees
Answer: Grinding and Dicing Services is in Semiconductors
Answer: Grinding and Dicing Services contact info: Phone number: +14********* Website: https://dieprepservices.com
Answer: The most experienced US supplier targeting complex wafer dicing and grinding services for diverse market segments including semiconductor, MEMS and life sciences to name a few. Continuity of support from NPI to commercial scale manufacturing for both commercial and military applications. Robust Static and Cleanliness controls capable of the most demanding specifications. GDSI is ISO 9001:2008 registered. Serving fab and fabless interests for over 20 Years. Why gamble with your material? Trust GDSI to process your critical projects. Specialties: Wafer dicing, Stealth Laser Dicing Process, wafer grinding, thinning, polish, inspection, wafer saw, SiC, Glass, Silicon, MEMS, pick & place, 300mm, Die Bonding
Answer:
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