E Bonsella

Consumer Electronics, Scripps SMT Ct, San Diego, , 92131, California, 10636, United States, 1-10 Employees

Phone Number: +14*********

Who is EBONSELLA

We Provide Contract Engineering, Manufacturing + Fabrication Solutions. We are a Manufacturers Representative for Local + Global Technology Companies- PCB Fabrication, Injection Molding, ...

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Headquarters: 10636 Scripps SMT Ct, San Diego, California, 92131, United States
Date Founded: 2007
Employees: 1-10
Revenue: Under $1 Million
Active Tech Stack: See technologies

Industry: Consumer Electronics

SIC Code: 7336

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Al Slade

Sales Rep

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Frequently Asked Questions Regarding EBonsella

Answer: eBonsella's headquarters are located at Scripps SMT Ct, San Diego, , 92131, California, 10636, United States

Answer: We Provide Contract Engineering, Manufacturing + Fabrication Solutions. We are a Manufacturers Representative for Local + Global Technology Companies- PCB Fabrication, Injection Molding, Membranes, Silicone Key Pads, Cables, Contract Manufacturing and separately Provide Engineering , Fabrication & Manufacturing Services for Proto Typing, NPI Activities to Production.We allow Flexibility, Scalability for Companies to concentrate on their Core Technology and Business in an ever changing Global Environment. We support the Industries of Biotech, Life Science, Industrial, Semiconductor, Capital Equipment, High Tech,Wireless, Alternative Energy, Consumer Electronics, Military, Research and Development and Infrastructure.We offer complete design, engineering, and manufacturing services to aerospace, automotive, computing, consumer digital, industrial, infrastructure, medical and mobile OEM customers. We are on the West coast of the United States . We help our Local and Global customers design, build, ship, and service electronics products worldwide by combining the advantages of a vertically integrated service offering with the benefits of a global, low-cost manufacturing base. We enable customers to optimize supply chain operations, accelerate time to market and time to volume, and reduce capital investments and production costs. Chip On Board or COB, Chip On Flex or COF, Plated Thru Hole Technology or PTH and IC Assembly Ball Grid Array or BGA , micro Ball Grid Array or u BGA Flip Chip Attach or FCA Wafer Thinning, Sawing, Inspection Die Attach by Epoxy or Eutectic Wire Bonding by Aluminum Wedge, Gold Wedge, Gold Ball Wire Bond Pull, Die Shear and Die Encapsulation Ceramic Packages, Side Brazed, LCC, J-Bend, SOIC, PGA, Flat Pack, Cerquad, TO-Header, Cerdip, Leaded Chip Carrier,Turnkey and Consigned Assembly offering Design for Manufacturability or DFM , Material Logistics Low to High Volume 24 Hour, 2-3 Days Quick Turn Services BGA, FPGA, Fine Pitch Components