Denkai America
Consumer Electronics, 29 Battleship Rd, Camden, South Carolina, United States, 51-200 Employees
Phone Number: +15*********
Who is DENKAI AMERICA
Denkai America is a leader in the manufacture of high-quality electrodeposited copper foils for printed circuit board (PCB), industrial, and energy storage applications. With the strength...
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Headquarters: 29 Battleship Rd, Camden, South Carolina, United States
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Date Founded: 1976
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Employees: 51-200
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Revenue: $25 Million to $50 Million
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Active Tech Stack: See technologies
Industry: Consumer Electronics
SIC Code: 3331
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NAICS Code: 331410 |
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Frequently Asked Questions Regarding Denkai America
Answer: Denkai America's headquarters are located at 29 Battleship Rd, Camden, South Carolina, United States
Answer: Denkai America's phone number is +15*********
Answer: Denkai America's official website is https://oakmitsui.com
Answer: Denkai America's revenue is $25 Million to $50 Million
Answer: Denkai America's SIC: 3331
Answer: Denkai America's NAICS: 331410
Answer: Denkai America has 51-200 employees
Answer: Denkai America is in Consumer Electronics
Answer: Denkai America contact info: Phone number: +15********* Website: https://oakmitsui.com
Answer: Denkai America is a leader in the manufacture of high-quality electrodeposited copper foils for printed circuit board (PCB), industrial, and energy storage applications. With the strength of domestic manufacturing, and backed by a global presence, Denkai America delivers both conventional cladding and application specific copper foils required by technology leading companies. For over 40 years, we have manufactured copper foil with the highest level of quality and service. This commitment to our customers, both domestic and abroad, will not change. At Denkai America, copper foils are electroplated on revolving titanium drums, unique for the ability to deposit copper foils with a high-quality surface. Rolls of the plated foils are then subjected to a variety of surface treating operations specially designed for a wide range of end-use requirements. During treating, copper dendrites are deposited onto the foil surface to enhance bonding to various resins systems during lamination. A barrier-layer is deposited for promoting reliability in thermal applications, specific proprietary organic layers are applied to promote chemical adhesion, and foils are stain-proofed to prevent oxidation in shipping, storage, lamination, and subsequent customer processing.
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