Cost Effective Equipment

Cost Effective Equipment

Semiconductors, 6 Industrial Dr, St James, Missouri, 65559, United States, 11-50 Employees

costeffectiveequipment.com

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Who is COST EFFECTIVE EQUIPMENT

Cost Effective Equipment has been an industry benchmark since 1987 when we produced the worlds first semiconductor-grade benchtop bake-plate for silicon wafer processing. In 1992 we launc...

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  • 6 Industrial Dr, St James, Missouri, 65559, United States Headquarters: 6 Industrial Dr, St James, Missouri, 65559, United States
  • 1987 Date Founded: 1987
  • 11-50 Employees: 11-50
  • dollar-icon Revenue: Under $1 Million
  • tech-icon Active Tech Stack: See technologies

industries-icon Industry: Semiconductors

SIC SIC Code: 3559

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Cost Effective Equipment Org Chart and Mapping

Employees

Jim Strothmann

Senior Development Engineer

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Frequently Asked Questions Regarding Cost Effective Equipment

Answer: Cost Effective Equipment's headquarters are located at 6 Industrial Dr, St James, Missouri, 65559, United States

Answer: Cost Effective Equipment's official website is https://costeffectiveequipment.com

Answer: Cost Effective Equipment's revenue is Under $1 Million

Answer: Cost Effective Equipment's SIC: 3559

Answer: Cost Effective Equipment has 11-50 employees

Answer: Cost Effective Equipment is in Semiconductors

Answer: Cost Effective Equipment contact info: Phone number: Website: https://costeffectiveequipment.com

Answer: Cost Effective Equipment has been an industry benchmark since 1987 when we produced the worlds first semiconductor-grade benchtop bake-plate for silicon wafer processing. In 1992 we launched another industry first with the Cee Model 100 spin coater. These tools established Cee then a part of Brewer Science Inc. as a leader in high-precision wafer process instruments for demanding applications. Cee spin coaters and hotplates are routinely used for photoresist and anti-reflective coatings for photolithography, e-beam resists, sol-gels, packaging adhesives, adhesion promoters, dielectrics, and SU-8 as well as photomask processing. Over the decades since, our product line expanded to include spin-develop and spin-clean systems as well as wafer chill-plates and large-area panel processing tools. In 2016 at the CS Mantech show we introduced a complete line of temporary wafer bonders and debonders for laboratory and small volume production. These tools are especially suited for compound semiconductors, wafer-thinning processes, and wafer-level packaging. Headquartered in Saint James, Missouri USA, we work through a network of trained international distributors to supply and support your needs.

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