Cost Effective Equipment
Semiconductors, 6 Industrial Dr, St James, Missouri, 65559, United States, 11-50 Employees
Who is COST EFFECTIVE EQUIPMENT
Cost Effective Equipment has been an industry benchmark since 1987 when we produced the worlds first semiconductor-grade benchtop bake-plate for silicon wafer processing. In 1992 we launc...
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- Headquarters: 6 Industrial Dr, St James, Missouri, 65559, United States
- Date Founded: 1987
- Employees: 11-50
- Revenue: Under $1 Million
- Active Tech Stack: See technologies
Industry: Semiconductors
SIC Code: 3559
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Frequently Asked Questions Regarding Cost Effective Equipment
Answer: Cost Effective Equipment's headquarters are located at 6 Industrial Dr, St James, Missouri, 65559, United States
Answer: Cost Effective Equipment's official website is https://costeffectiveequipment.com
Answer: Cost Effective Equipment's revenue is Under $1 Million
Answer: Cost Effective Equipment's SIC: 3559
Answer: Cost Effective Equipment has 11-50 employees
Answer: Cost Effective Equipment is in Semiconductors
Answer: Cost Effective Equipment contact info: Phone number: Website: https://costeffectiveequipment.com
Answer: Cost Effective Equipment has been an industry benchmark since 1987 when we produced the worlds first semiconductor-grade benchtop bake-plate for silicon wafer processing. In 1992 we launched another industry first with the Cee Model 100 spin coater. These tools established Cee then a part of Brewer Science Inc. as a leader in high-precision wafer process instruments for demanding applications. Cee spin coaters and hotplates are routinely used for photoresist and anti-reflective coatings for photolithography, e-beam resists, sol-gels, packaging adhesives, adhesion promoters, dielectrics, and SU-8 as well as photomask processing. Over the decades since, our product line expanded to include spin-develop and spin-clean systems as well as wafer chill-plates and large-area panel processing tools. In 2016 at the CS Mantech show we introduced a complete line of temporary wafer bonders and debonders for laboratory and small volume production. These tools are especially suited for compound semiconductors, wafer-thinning processes, and wafer-level packaging. Headquartered in Saint James, Missouri USA, we work through a network of trained international distributors to supply and support your needs.
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